μLaser is a low cost direct optical lithography system oriented to universities and research facilities looking to expand their capabilities.
It writes on a photosensitive resist coated surface with a 405nm laser at submicron pixel resolution on big areas. You can write anything from photomasks to research prototypes for basic or applied science.
We have optimized it for ease of use and low cost fabrication and maintenance, maximizing the use of off-the-shelf parts without sacrificing writing quality nor its capabilities.
Direct laser lithography greatly reduces costs and execution times in areas such as microfluidics, microelectronics, micromechanics and material science research, by eliminating the dependence of external suppliers for the production of photomasks.
µLaser can get to sub-micron resolution and produce ten micron features.
You can make full size photomasks for production or in-house usage.
µLaser is controlled from an user friendly software on a laptop. It can import GDSII files and PNG images
The last lens is an industry standard microscope objective. Replace it to change the spot size!.
We include three microscope objectives.
Using the confocal yellow illumination and camera you can use the µLaser as a microscope
We have managed to keep the prices low allowing you to have a better lab on a tight budget.
μLaser is delivered with its control software on a PC. It allows you to import the designs to be written from cells of GDSII files or directly from PNG images.
Everything is done from a user friendly graphical interface that allows you preview the design to write before executing it.
Multiple designs can be combined in a single process, in addition to applying transformations such as rotations, reflections, inversions or scale adjustments to each design.
After defining the design, the included stage control modules and the confocal microscope are used.
With them you set the origin position of the process on the substrate and the focal plane on the photosensitive surface.
Next the process is executed and the design is written on the surface.
Typical writing speed 100-120 mm/s
Maximum area 100x92 mm^2
Minimum area There isn’t a minimum area
Unidirectional positioning step X = 0.16 µm, Y = 1.00 µm
Mechanical noise on the slow X axis < 1 µm
Mechanical noise on the fast Y axis < 1 µm
Multi layer aligning accuracy 5-10 µm (Optional rotary stage for easier aligning)
Realistic minimum feature size: 6-15µm depending on the feature (see pictures below for examples)
Supported formats PNG,GDSII
In-software transformations Rotation, Reflection, Inversion, Rescaling, Add border
-Multiple designs from different files can be written in one process
-Tilted/warped substrate compensation via 3-point linear or 4-point bilinear focus measurement
-Mesh type calibration for full-bed curvature compensation
-Laser wavelength: 405nm (optional 375nm)
-Confocal microscope for laser focusing, aligning and inspection
-Secondary independent yellow illumination
-Laser spot size can be changed using industry standard microscope objectives
Raster step of included objectives:
-Fine: 0.8 µm
-Medium: 2 µm
-Coarse: 5 µm
Effective writing speed of included objectives on big areas (unidirectional writing):
-Fine: 1.7 mm^2/min
-Medium: 4.25 mm^2/min
-Coarse: 10.6 mm^2/min
Speed doubles in bidirectional writing mode.
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