The writer

μLaser is a low cost direct optical lithography system oriented to universities and research facilities looking to expand their capabilities.

It writes on a photosensitive resin coated surface with a 405nm laser at 0.8um pixel resolution on big areas. You can write anything from photomasks to research prototypes for basic or applied science. 

We have optimized it for ease of use and low cost fabrication and maintenance, maximizing the use of off-the-shelf parts without sacrificing writing quality nor its capabilities. 

Direct laser lithography

Direct laser lithography greatly reduces costs and execution times in areas such as microfluidics, microelectronics, micromechanics and material science research, by eliminating the dependence of external suppliers for the production of photomasks.

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The software

μLaser is delivered with its control software on a PC. It allows you to import the designs to be written from cells of GDSII files or directly from PNG images.

Everything is done from a user friendly graphical interface that allows you preview the design to write before executing it.

Multiple designs can be combined in a single process, in addition to applying transformations such as rotations, reflections, inversions or scale adjustments to each design.

After defining the design, the included stage control modules and the confocal microscope are used.

With them you set the origin position of the process on the substrate and the focal plane on the photosensitive surface. Also, the microscope can be used to align with preexisting designs.

Next the process is executed and the design is written on the surface.




XY Stage

Typical writing speed                                        100-120 mm/s

Maximum area                                                     100x92 mm^2

Minimum area                                                      There isn’t a minimum area

Unidirectional positioning step                     X = 0.16 µm, Y = 1.00 µm

Mechanical short range noise on the slow X axis ≤ 1 µm, 

Mechanical long range noise on the fast Y axis ≤ 1 µm


Supported formats                                            PNG,GDSII

In-software transformations                         Rotation, Reflection, Inversion, Rescaling, Add border

-Multiple designs from different files can be written in one process

-Tilted substrate compensation via 3-point focus measurement

-Mesh type calibration for full-bed curvature compensation


-Confocal microscope for laser focusing, aligning and inspection

-Secondary independent yellow illumination

-Laser spot size can be changed using industry standard microscope objectives

Raster step of included objectives:

-Fine:                0.8 µm   

-Medium:        5 µm

-Coarse:          10 µm

Effective writing speed of included objectives on big areas (unidirectional writing):

-Fine:                1.7 mm^2/min

-Medium:        10 mm^2/min

-Coarse:           21 mm^2/min